
Over the last year, the memory component market has transitioned from a manageable state to a tighter environment. DDR4 end-of-life (EOL) notices are colliding with AI buildouts that prioritize high-bandwidth parts and advanced nodes, pulling capacity away from legacy lines.
As fabs rebalance, we’ve seen availability tighten, lead times drift, and pricing become more volatile, especially on industrial and extended lifecycle builds. For OEMs, CMs, and EMS providers, the stakes are clear: align roadmaps to changing supply dynamics or risk production gaps and escalating costs.
DDR4 has been a staple of system memory design for more than a decade, but leading suppliers have signaled its phase-out. Micron, Samsung, and SK Hynix have all announced last-time-buy (LTB) windows, with some closing as early as late 2025. These declarations are often a catalyst for rapid shifts in the market, and the transition away from DDR4 is no different.
Shortage-like conditions are the first trend to follow, emerging as shrinking allocations and higher prices alter buying trends. From there, the downstream effects multiply as OEMs and other buyers scramble to ensure production continuity.
The current period of memory market disruption isn’t just a response to typical technology transitions as DDR4 production winds down, though. Demand for AI hardware is accelerating the supply crunch by diverting engineering and fab capacity toward next-gen products, such as DDR5 and HBM. Rather than working to help fulfill LTB orders for crucial DDR4 components, many suppliers have already reorganized their production capacity in favor of newer parts with higher profit margins.
As a result, buyers accustomed to stable DDR4 availability even as recently as the beginning of this year are now contending with partial allocations, reduced forecast flexibility, and rapidly escalating prices.
The entire memory economy is being reshaped by AI. Both training and inference models, especially those with longer context windows and larger parameter counts, require significantly more DRAM per system. They are also hungry for faster storage tiers to keep accelerators fully utilized. This demand is most obvious in hyperscale deployments, where GPUs and AI accelerators must be fed continuously to avoid bottlenecks.
Micron and other tier-one suppliers are prioritizing parts that serve these workloads. HBM supply, for example, is being booked out well into 2026 by leading AI and cloud computing companies. The same fabs that recently supported mature-node DRAM like DDR4 are now being tuned to meet the unique requirements of AI-focused customers. As a result, legacy DRAM production is increasingly being squeezed out even before official EOL timelines are reached.
TrendForce notes that this shift is structural, and that it won’t disappear anytime soon. Samsung and SK Hynix are both planning aggressive capacity increases for advanced memory by 2026 while pulling back from legacy nodes and NAND production. With the focus on AI, sudden orders for HBM supply and advanced-node DRAM can also unexpectedly pull remaining fab time, leaving gaps in mature nodes.
As AI models scale, the once stable memory market is experiencing more frequent pinch points. DDR4 shortages began to emerge as LTB announcements coincided with sudden increases in AI-driven orders. Select DDR4 parts, especially those for industrial, automotive, and other high-reliability sectors, are now becoming scarce.
This has led multiple suppliers to increase DRAM pricing across the board in the second half of 2025. Tom’s Hardware reports that price hikes from tier-one manufacturers including Samsung, Micron, and SK Hynix have ranged from 15% to 30% in recent weeks. Even smaller suppliers, like SanDisk, have announced their own price increases after Micron suspended quotations in the latter half of September.
Amid formal EOLs and artificially constrained production, component lead times are also drifting upward. As a result, buyers relying on just-in-time replenishment or late LTB planning face significant risk in the months ahead.
To navigate the DDR4 EOLs and combat shortages caused by rising AI demand, strategic planning is paramount. Several steps can help buyers mitigate risk and ensure supply continuity.
The DDR4 EOL process, while expected, is moving faster than most of the industry predicted. As fabs race to support next-gen formats and HBM supply, buyers will be rewarded for proactive planning and disciplined execution.
By auditing DDR4 dependencies, securing LTBs, pre-qualifying alternatives, and tracking how AI demand affects memory, teams can stabilize builds and budgets despite the challenging environment. Partnering with a distributor built for volatility is also essential.
Sourceability equips customers with market intelligence, vetted suppliers, and lifecycle support to ensure uninterrupted production. Our hybrid model blends global digital reach with local, tenured sourcing expertise with a network spanning over 60 franchise and direct relationships.
When lead times stretch and allocation shrinks, Sourceability gives you access to trusted alternatives across multiple regions to keep your production lines running, protect your margins, and help you meet delivery commitments.